IBM along with Common Platform technology partners Chartered Semiconductor, Samsung Electronics, Infineon and Freescale have signed a series of development and manufacturing agreements. The joint development agreements include the 32nm bulk CMOS manufacturing process and other supporting technologies.
“IBM remains convinced that collaborative innovation in an open ecosystem of partners is the key to technology leadership, both now and in the years to come,” said Michael Cadigan, general manager, semiconductor solutions, IBM Global Engineering Solutions. “Today’s announcement validates that strategy by meeting client requirements for leadership technology. With the extensions of our agreements to the 32nm generation – including manufacturing and IBM Research to complement the proven joint development model in place for well over a decade – IBM is working together with its alliance partners to deliver leading-edge technology that promises to dramatically change the way we live, work and play.”
A number of technology advancements by IBM will be incorporated into the new designs by the five companies, including implementation of new materials such as high-k/metal gate and immersion lithography to achieve competitive density and chip size.
Several of the partnering companies had previous agreements at 90nm, 65nm and 45nm processes and are extending their efforts to manufacture at 32nm through 2010. As with previous nodes, 32nm development activities will be conducted at IBM’s state-of-the-art 300mm semiconductor fabrication facility in East Fishkill, N.Y.
Source Dailtech: - IBM and four other semiconductors band together to hit 32nm chips